Field briefing
H10W · Generic packages, interconnections, connectors or other constructional details of…
Generic packages, interconnections, connectors or other constructional details of devices covered by class h10. Patents classified in CPC H10W, part of Electricity and electronics.
Dates, owners, statuses and filings come from the published records. Derived views are counted from them. Highlighted text is a plain-English AI reading, written from a patent's title and abstract. Legal statuses and expiry dates are estimates, not legal advice.
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Connected industries
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Newest patents in H10W · Generic packages, interconnections, connectors or other constructional details of…
167 patents imported from the European Patent Office; newest published 2026-10-09; most active companies: Texas Instruments Inc, NXP BV, Samsung Electronics Co Ltd.
- 接触焊盘上具有残余弹性的连接导线的电绝缘 CN122893215A, published 2026-10-09
- CONCENTRIC DTC BUMPS FOR HIGH DENSITY PACKAGE DECAP SOLUTION US20260313924A1, published 2026-10-08
- ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES US20260312273A1, published 2026-10-08
- CIRCUIT PACKAGE STRUCTURE WITH A CONDUCTIVE PILLAR AND RELATED CONDUCTIVE PILLAR US20260305355A1, published 2026-10-01
- VERTICAL BALUN FOR DIFFERENTIAL-TO-SINGLE ENDED TRANSITION OF MM-WAVE SIGNALS US20260305361A1, published 2026-10-01
- WAVEGUIDES AND FABRICATION THEREOF US20260302580A1, published 2026-10-01
- MILLIMETER-WAVE ANTENNA US20260302593A1, published 2026-10-01
- SYSTEMS INCLUDING TWO-DIE INTEGRATED CIRCUIT (IC) PACKAGES AND HOMOGENEOUSLY-ORIENTED MEMORY CONNECTORS AND RELATED METHODS US20260304961A1, published 2026-10-01
- HP-HV-PULSED POWER SUPPLY AND A METHOD OF COOLING OF SUCH AN HP-HV-PULSED POWER SUPPLY EP4815654A1, published 2026-09-30
- BGA-TYPE RADIO FREQUENCY DEVICE EP4815194A2, published 2026-09-30
- POWER SEMICONDUCTOR MODULE AND ASSEMBLY METHOD EP4815036A1, published 2026-09-30
- 表示装置 JP2026149652A, published 2026-09-25
- DISPOSITIF DE REFROIDISSEMENT A PROJECTION DE FLUIDE DIELECTRIQUE COMPRENANT UN CONDUIT INTEGRE FR3173423A1, published 2026-09-25
- PACKAGE COMPRISING A CONFIGURABLE INDUCTOR US20260293166A1, published 2026-09-24
- INTEGRATED CIRCUIT WITH EMBEDDED SUBSTRATE AND MAGNETIC MOLD COMPOUND US20260293759A1, published 2026-09-24
- EMBEDDED LC MODULES FOR PACKAGED SEMICONDUCTOR DEVICES US20260293760A1, published 2026-09-24
- PACKAGE FOR RED-GREEN-BLUE LASER DIODES WO2026198780A1, published 2026-09-24
- 用于RF模块的定制RF电感器 CN122803734A, published 2026-09-22
- 结构构件 CN122803754A, published 2026-09-22
- POWER MANAGEMENT CIRCUIT HAVING THIN-FILM INDUCTORS US20260282962A1, published 2026-09-17
- ELECTRONIC DEVICE US20260282934A1, published 2026-09-17
- 显示装置、制造显示装置的方法以及包括显示装置的电子装置 CN122766043A, published 2026-09-15
- 形成具有嵌入式衬底的AIP模块的半导体器件和方法 CN122766355A, published 2026-09-15
- 紫外光照射装置及安装系统 CN122742644A, published 2026-09-11
- ELECTRONIC DEVICE US20260271803A1, published 2026-09-10
Most active companies
Counted over the newest 167 imported patents in this industry.
- Texas Instruments Inc 6 patents
- NXP BV 5 patents
- Samsung Electronics Co Ltd 5 patents
- Semiconductor Energy LAB 5 patents
- Qualcomm Inc 4 patents
- Applied Materials Inc 3 patents
- Heptagon Micro Optics PTE Ltd 3 patents
- Infrasolid GmbH 3 patents
Connected industries
- H10D · Inorganic electric semiconductor devices 37 patents in both
- H05K · Printed circuits 35 patents in both
- H01K · Electric incandescent lamps 29 patents in both
- H01Q · Antennas, i.e. radio aerials 27 patents in both
- H01C · Resistors 25 patents in both